Tensor I22
Product Code: Tensor I22
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Product Condition: New
Fanless industrial computer for loT edge applications
Features
- Fanless industrial loT edge computer
- Intel® 11th Gen. Core processor
- Up to 3 NVMe + SATA storage devices
- 2x/4x Gigabit LAN
- Wide multiple wireless connectivity options
- Up to 20 COM ports: RS-232/RS-485
- 12V - 56V DC power input
Specifications
CPU | Intel® Core i7-1185G7E | 4 Core | Base: 1.8/2.8 GHz, Boost: 4.4 GHz | TDP: 15/28 3 W | vPro |
| Intel® Core i5-1145G7E | 4 Core | Base: 1.5/2.6 GHz, Boost: 4.1 GHz | TDP: 15/28 3 W | vPro |
| Intel® Celeron 6305E | 2 Core | Base: 1.8 GHz | TDP: 15 W |
Memory | Type | 2x SO-DIMM DDR4 up to 3200MT/s |
| Max. capacity | 64 GB |
Storage | Storage devices | Up to 3 NVMe/ SATA storage devices |
| In basic configuration | NVMe or SATA on M.2 (PCIe x4 Gen. 4 or SATA 3) |
| Optional TEL-NVME on TRIP1 | Additional NVMe on M.2 (PCIe x4 Gen. 3) |
| Optional TEL-NVME on TRIP2 | Additional SATA on M.2 |
| Optional TEL-SATA1 1 | Additional SATA on 2.5" for SSD/HDD |
Display | Display outputs | 4 independent displays |
| HDMI | 2x HDMI 1.4b (up to 3840 x 2160 @ 30Hz) |
| Mini-Display Port | 2x DP 1.2 (up to 4096 x 2160 @ 60Hz) Dual mode |
Ethernet | Ethernet ports | Up to 4 ports |
| In basic configuration | 2x Gigabit Ethernet on RJ45 |
| Optional TEL-LANX2 | Additional 2x Gigabit Ethernet on RJ45 |
| Optional TEL-OPLNX2 | Additional 2x SFP+ ports for optical LAN |
| Optional TEL-POEX2 1 | Additional 2x GbE LAN on RJ45 with PoE source of up to 15W each |
Wireless | M.2 Key-E 2 | For M.2 2230 module with Wi-Fi 6E, BT 5.2 |
Connectivity | M.2 Key-B 2 | For M.2 LTE/5G |
| Optional TEL-PCIEmini | For mini PCIe module, w/ micro-SIM tray |
USB | USB ports | Up to 12 USB 3.1 / 2.0 ports |
| In basic configuration | 4x USB Type-A: 2x USB 3.1 + 2x USB 2.0 |
| Optional TEL-USB3V4 | Up to 2 additional 4x USB 3.1 on USB Type-A |
| Optional TEL- USB2V4 | Up to 2 additional 4x USB 2.0 on USB Type-A |
Serial/GPIO | Optional Serial/GPIO ports 1 | Up to 20 RS-232 / RS-485 or 40+ isolated GPIOs |
| Optional RS-232 / RS-485 1 | Up to 20 RS-232 / RS-485 ports on DB9 |
| Optional CAN bus | Up to 5 isolated CAN bus ports on DB9 |
| Optional GPIO | Up to 5 modules with 20 isolated GPIOs each, on terminal blocks |
Audio | Codec | Optional analog audio on TEL-AUDIO |
| Interfaces | Optional analog output, analog input on 3.5 mm jacks |
Power | Standard voltage input | 12V, 5.5 mm power jack w/ locking, 60W universal PSU |
| Optional wide voltage input | 12-56V, 6-pin ATX power connector w/ locking, 120W universal PSU |
TPM | Internal firmware TPM | Intel® PTT (TPM 2.0) |
| Discreet TPM | Optional discreet TPM 2.0: RSA-2048, ECC-256, SHA-256, EAL4+ |
OS support | Windows 10 | Windows 10 IoT Enterprise LTSC 2021 / Windows 10 Pro |
| Windows 11 | Windows 11 Pro |
| Linux | Linux Mint / Ubuntu |
Operating | Commercial temperature | 0°C to 45°C |
Environment | Extended temperature | -20°C to 70°C, sample testing |
| Industrial temperature | -40°C to 70°C, full testing |
| Humidity | 5% - 95% non-condensing |
Mechanical | Cooling | Fanless, passive cooling |
Characteristics | Dimensions | 200 mm X 200 mm X 35.3 mm for standard housing |
| Mounting | Side/bottom VESA / DIN Rail mount |
Notes:
1. Some expansion TELs require a larger housing
2. Additional options are available with extension TELs
3. For 28W CPU operation, EW30-ECR20 housing is recommended (300 X 200 X 45.3 mm)
Dimensions
Note: The above are the dimensions of a standard Tensor-I22. Additional housing options are available, with different lengths, heights, and cooling rib heights.
Interfaces
Location | Connector |
| Interface |
|
Rear Panel | Power input: 5.5mm jack / 6-pin ATX conn. | 12V, up to 60W / 12v - 56V, up to 120W | ||
| Optional 2x 3.5mm jacks | Optional analog audio (TEL-AUDIO) | ||
| 2x HDMI |
| HDMI 1.4b (up to 3840 x 2160 @ 30Hz) | |
| 2x mini-DP | DP 1.2 (up to 4096 x 2160 @ 60Hz) Dual mode | ||
| 2x RJ45 |
| 2 x RJ45 10/100/1000 Mbps Ethernet | |
| 2x USB Type-A | 2x USB 2.0 | ||
| 2x USB Type-A |
| 2x USB 3.1 |
|
Front Panel | Power button | On/Off push button w/ power LED | ||
| Optional expansion TELs | 2x RJ45, DB9, terminal block, etc. | ||
Right Panel | 2x SMA | 2x SMA antennas for Wi-Fi/BT or cellular modem | ||
| Optional expansion TELs | 2x RJ45, DB9, terminal block, etc. | ||
Left Panel | 2x SMA | 2x SMA antennas for Wi-Fi/BT or cellular modem | ||
| Optional expansion TELs | 2x RJ45, DB9, terminal block, etc. | ||
Location | Connector | Form factor | Interface | Usage |
Internal | 2x SO-DIMM | DDR4 SO-DIMM | DDR4, up to 3200 MT/s | 2x DDR4 module |
| M.2 Key-B | M.2 Up to 3060 | PCIe Gen 3 x1 + USB 2.0 | LTE/5G modem |
| M.2 Key-E | M.2 2230 | PCIe Gen 3 x1 + USB 2.0 | Wi-Fi/BT module |
| M.2 Key-M | M.2 up to 2280 | PCIe Gen 3 x4 / SATA | NVMe/SATA storage/AI |
| TRIP1 | Expansion TEL | PCIe Gen 3 x4/ 2x PCIe | TEL expansions for TRIP1 |
| TRIP2 | Expansion TEL | PCIe Gen 3 x1 / SATA | TEL expansions for TRIP2 |
4-pin internal USB | Expansion TEL | USB 2.0 | USB TEL expansions |
Optional TEL expansion modules - 1 of 2
TEL | Description | Max. quantity | Where connected | PN |
FT.C-LAN2 | Additional 2x Gbit LAN 1 | 1 | TRIP1 | FC |
FT.EC-USB2V4 | Additional 4x USB 2.0 1 | 2 | TRIP1 / TRIP2 | FEC |
FT.ED-USB3PCIV4 | Additional 4x USB 3.0 1 | 2 | TRIP1 / TRIP2 | FED |
FT.F-M2NVME for NVMe | Additional M.2 Key-M for NVMe 1 | 1 | TRIP1 | FFN |
FT.F-M2NVME for SATA | Additional M.2 Key-M for SATA 1 | 1 | TRIP2 | FFS |
FT.F-M2NVME for AI | Additional M.2 Key-M for AI module3 | 1 | TRIP1 | FFA |
FT.H-SER4 | 1-4 isolated RS232 or RS485 | 3 | TRIP1 / TRIP2 / int. USB | FH |
FT.HB-DB9 | DB9 connector for FT.H-SER4 | 3 per FT.H-SER4 | FT.H-SER4 | FHB |
FT.HA-SER1 | 1 port RS232 | 3 | TRIP1 / TRIP2 / int. USB | FHA |
FT.I-M2B | Additional M.2 Key-B for modem 1 | 2 | TRIP1 / TRIP2 | FI |
FT.J-M2E | Additional M.2 Key-E for Wi-Fi/BT 1 | 2 | TRIP1 / TRIP2 | FJ |
FT.L-PCIEmini | Mini PCIe compartment | 2 | TRIP1 / TRIP2 | FL |
FT.Q-CAN | Isolated CAN bus port | 3 | TRIP1 / TRIP2 / int. USB | FQ |
Optional TEL expansion modules - 2 of 2
TEL | Description | Max. quantity | Where connected | PN |
FT.S-GPIO | 4 - 20 isolated GPIOs | 3 | TRIP1 / TRIP2 / int. USB | FS |
FT.V-TERM4 | Terminal block 4x for FT.S-GPIO | 4 per FT.S-GPIO | FT.S-GPIO | FV |
FT.T-SATA1 2 | SATA for 2.5" HDD/SSD | 1 | TRIP2 | FT |
FT.U-POE2 | 2x Gbit LAN with PoE | 1 | TRIP1 | FU |
FT.W-OPLN2 | 2x Gbit LAN on SFP+ for optical LAN | 1 | TRIP1 | FW |
Notes:
- This interface is also available in some quantity on the motherboard, without a TEL expansion module.
- T-SATA1 requires larger housing: EH35C or EW30
- F-M2NVME for AI includes enhanced heat dissipation for AI acceleration modules that use PCIe x1/x2/x4